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DATA SHEET
ED1002CS~ED1006CS
SURFACE MOUNT SUPER FAST RECOVERY RECTIFIER VOLTAGE
FEATURES
* For surface mounted applications * Low profile package * Built-in strain relief * Easy pick and place * Superfast recovery times for high efficiency * Plastic package has Underwriters Laboratory Flammability Classification 94V-O * Glass passivated junction * Both normal and Pb free product are available : Normal : 80~95% Sn, 5~20% Pb Pb free: 98.5% Sn above
.225(5.7) .209(5.3) 0.040(1.0)
.02(0.5) .032(0.8) .012(0.3) .09 .09 (2.3) (2.3) .071(1.8) .051(1.3) .264(6.7) .248(6.3) .098(2.5) .082(2.1) .024(0.6) .016(0.4)
200 to 600 Volts
CURRENT
10 Amperes
TO-252 / DPAK
Unit : inch (mm)
MECHANICALDATA
Case: D PAK/TO-252 molded plastic Terminals: Solder plated, solderable per MIL-STD-750,Method 2026 Polarity: Color band denotes cathode Standard packaging: 16mm tape (EIA-481) Weight: 0.015 ounce, 0.4 gram.
.063(1.6) .047(1.2)
.106(2.7) .090(2.3)
.216(5.5) .200(5.1)
C
MAXIMUM RATING AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%
PARAMETER Maxi mum Recurrent Peak Reverse Voltage Maxi mum RMS Voltage Maxi mum D C Blocki ng Voltage Maxi mum Average Forward C urrent .375"(9.5mm) lead length at Tc=100OC Peak Forward Surge C urrent, 8.3ms si ngle half si ne-wave superi mposed on rated load(JED EC method) Maxi mum Forward Voltage at 5.0A Maxi mum D C Reverse C urrent TA=25 OC at Rated D C Blocki ng VoltageTA=100 OC Maxi mum Reverse Recovery Ti me (Note 1) Maxi mum thermal Resi stance (Note 2) Operati ng and Storage Temperature RangeTJ,TSTG
SYMBOL VRRM VRMS VDC IAV IFSM VF IR TRR RJC RJA TJ,TSTG
E D 1002C S 200 140 200
E D 1003C S 300 210 300
E D 1004C S 400 280 400
E D 1006C S 600 420 600
UNITS V V V A A
10.0 100 0.95 1.3 5.0 50 35 11 80 -55 TO +150
O
1.7
V uA ns C/W
O
C
NOTES: 1. Reverse Recovery Test Conditions: IF=.5A, IR=1A, Irr=.25A. 2. Mounted on P.C. Board with 14mm2 (.013mm thick) copper pad areas. 3. Both Bonding and Chip structure are available.
STAD-APR.08.2004
PAGE . 1
RATING AND CHARACTERISTIC CURVES
AVERAGE FORWARD CURRENT, AMPERES
8 6 4
.375"9.5mm LEADLENGHTS RESISTIVEORINDUCTIVE LOAD
PEAK FORWARD SURGE CURRENT,
10
150 125 100 75 50 25 0
8.3ms Single Half Since-Wave JEDEC Method
2 0 0 20 40 60 80 100
O
120
140
160
1
2
5
10
20
50
100
CASE TEMPERAURE, C Fig.1- FORWARD CURRENT DERATING CURVE
NO. OF CYCLE AT 60HZ
Fig.2- MAXIMUM NON - REPETITIVE SURGE CURRENT
10
3
10 50-200V
REVERSE CURRENT, uA
10
2
T J =125 C
O
FORWARD CURRENT, AMPERES
300-400V
10
1
1.0
10
0
10
-1
T J= 2 5 C
O
TA=2 5 C 0.1 0.4
O
10 -2
20
40
60
80
100
120
0.6
0.8
1.0
1.2
1.4
PERCENT OF RATED PEAK REVERSE VOLTAGE, %
FORWARD VOLATGE, VOLTS
Fig.3- TYPICAL REVERSE CHARACTERISTIC
Fig.4- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTIC
STAD-APR.08.2004
PAGE . 2

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